NTD4860N
Power MOSFET
25 V, 65 A, Single N--Channel, DPAK/IPAK
Features
?
Trench Technology
?
?
Low R DS(on) to Minimize Conduction Losses
Low Capacitance to Minimize Driver Losses
http://onsemi.com
? Optimized Gate Charge to Minimize Switching Losses
? These are Pb--Free Devices
Applications
? VCORE Applications
? DC--DC Converters
V (BR)DSS
25 V
R DS(ON) MAX
7.5 m Ω @ 10 V
11.1 m Ω @ 4.5 V
D
I D MAX
65 A
? High/Low Side Switching
MAXIMUM RATINGS (T J = 25 ° C unless otherwise stated)
G
Parameter
Symbol
Value
Unit
Drain--to--Source Voltage
Gate--to--Source Voltage
V DSS
V GS
25
± 20
V
V
S
N--CHANNEL MOSFET
2 3
3
3
Continuous Drain
Current R θ JA
(Note 1)
Power Dissipation
R θ JA (Note 1)
Continuous Drain
Current R θ JA
(Note 2)
Power Dissipation
R θ JA (Note 2)
Continuous Drain
Current R θ JC
(Note 1)
Power Dissipation
R θ JC (Note 1)
Steady
State
T A = 25 ° C
T A = 85 ° C
T A = 25 ° C
T A = 25 ° C
T A = 85 ° C
T A = 25 ° C
T C = 25 ° C
T C = 85 ° C
T C = 25 ° C
I D
P D
ID
P D
I D
P D
13
10
2.0
10.4
8.0
1.28
65
50
50
A
W
A
W
A
W
1 2 1
4 4
4
1
2
CASE 369AA CASE 369AC CASE 369D
DPAK 3 IPAK IPAK
(Bent Lead) (Straight Lead) (Straight Lead
STYLE 2 DPAK)
MARKING DIAGRAMS
& PIN ASSIGNMENTS
Pulsed Drain t p =10 m s
Current
Current Limited by Package
T A = 25 ° C
T A = 25 ° C
I DM
I DmaxPkg
130
45
A
A
4
Drain
4
Drain
4
Drain
Operating Junction and Storage
Temperature
Source Current (Body Diode)
Drain to Source dV/dt
T J ,
T STG
I S
dV/dt
--55 to
+175
42
6
° C
A
V/ns
1
2
3
Source Gate Drain Source
1
2
3
Single Pulse Drain--to--Source Avalanche EAS 84.5 mJ
Energy (T J = 25 ° C, V DD = 50 V, V GS = 10 V,
I L = 13 A pk , L = 1.0 mH, R G = 25 Ω )
Lead Temperature for Soldering Purposes T L 260 ° C
(1/8” from case for 10 s)
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
2
1 Drain 3
Gate
Gate Drain Source
Y = Year
WW = Work Week
4860N = Device Code
G = Pb--Free Package
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 6 of this data sheet.
? Semiconductor Components Industries, LLC, 2010
June, 2010 -- Rev. 1
1
Publication Order Number:
NTD4860N/D
相关PDF资料
NTD4863NA-35G MOSFET N-CH 25V 49A SGL IPAK
NTD4865NT4G MOSFET N-CH 25V 8.5A DPAK
NTD4904N-1G MOSFET N-CH 30V 79A SGL IPAK
NTD4905N-35G MOSFET N-CH 30V 67A SGL IPAK
NTD4906NT4G MOSFET N-CH 30V 10.3A SGL DPAK
NTD4909NT4G MOSFET N-CH 30V 8.8A SGL DPAK
NTD4910NT4G MOSFET N-CH 30V 37A DPAK
NTD4913NT4G MOSFET N-CH 30V 32A DPAK
相关代理商/技术参数
NTD4860NT4H 制造商:Rochester Electronics LLC 功能描述: 制造商:ON Semiconductor 功能描述:
NTD4863N 制造商:ONSEMI 制造商全称:ON Semiconductor 功能描述:Power MOSFET 25 V, 49 A, Single N-Channel, DPAK/IPAK
NTD4863N-1G 功能描述:MOSFET NFET 25V 49A 0.0093R DPAK RoHS:否 制造商:STMicroelectronics 晶体管极性:N-Channel 汲极/源极击穿电压:650 V 闸/源击穿电压:25 V 漏极连续电流:130 A 电阻汲极/源极 RDS(导通):0.014 Ohms 配置:Single 最大工作温度: 安装风格:Through Hole 封装 / 箱体:Max247 封装:Tube
NTD4863N--1G 制造商:ONSEMI 制造商全称:ON Semiconductor 功能描述:Power MOSFET 25 V, 49 A, Single N--Channel, DPAK/IPAK
NTD4863N-35G 功能描述:MOSFET NFET 25V 49A 0.0093R DPAK RoHS:否 制造商:STMicroelectronics 晶体管极性:N-Channel 汲极/源极击穿电压:650 V 闸/源击穿电压:25 V 漏极连续电流:130 A 电阻汲极/源极 RDS(导通):0.014 Ohms 配置:Single 最大工作温度: 安装风格:Through Hole 封装 / 箱体:Max247 封装:Tube
NTD4863N--35G 制造商:ONSEMI 制造商全称:ON Semiconductor 功能描述:Power MOSFET 25 V, 49 A, Single N--Channel, DPAK/IPAK
NTD4863NA-1G 功能描述:MOSFET NFET 25V 49A 0.0093R DPAK RoHS:否 制造商:STMicroelectronics 晶体管极性:N-Channel 汲极/源极击穿电压:650 V 闸/源击穿电压:25 V 漏极连续电流:130 A 电阻汲极/源极 RDS(导通):0.014 Ohms 配置:Single 最大工作温度: 安装风格:Through Hole 封装 / 箱体:Max247 封装:Tube
NTD4863NA-35G 功能描述:MOSFET NFET DPAK 25V 49A 0.0093R RoHS:否 制造商:STMicroelectronics 晶体管极性:N-Channel 汲极/源极击穿电压:650 V 闸/源击穿电压:25 V 漏极连续电流:130 A 电阻汲极/源极 RDS(导通):0.014 Ohms 配置:Single 最大工作温度: 安装风格:Through Hole 封装 / 箱体:Max247 封装:Tube